MEMS microphone packaging structure
US9319764B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Mar 8, 2013 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Dec 3, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D48/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.