Printed circuit board and method for manufacturing the same
US9320137B2 · kind B2 · utility
3Cited by
1References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2012 |
| Grant date | Apr 19, 2016 |
| Priority date | — |
| Expiry date | Jun 11, 2032 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a flexible substrate divided into first, second, and third regions, a first rigid substrate in the first region of the flexible substrate, and a second rigid substrate in the third region of the flexible substrate. The first and second substrates expose the second region of the flexible substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.