Modular liquid-cooled power semiconductor module, and arrangement therewith

US9320182B2 · kind B2 · utility

Assignee

• SEMIKRON ELEKTRONIK GMBH & CO. KG · DE

Inventors

• Jürgen Steger · Hiltpoltstein, DE
• Markus Knebel · Tuchenbach, DE
• Peter Beckedahl · Oberasbach, DE
• Andreas MAUL · Koblenzer Straße, DE
• Susanne Kalla · Ebermannsdorf, DE

Key dates

• Filing date: Apr 17, 2013
• Grant date: Apr 19, 2016
• Expiry date: Dec 7, 2033

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A power semiconductor module, and an arrangement using the module. The module has a basic parallelepipedal shape with opposed pairs of main, longitudinal and narrow sides, a cooling device which is capable of carrying a flow of a cooling fluid, having a power electronics switch and a housing. The cooling device has a cooling volume with at least one cooling face and four connection devices which are arranged in pairs on the main sides. In addition, the connection devices carry the cooling fluid and are designed as a flow inflow and a flow outflow and as a return inflow and a return outflow, respectively. The power electronics switch has load input connection devices and load output connection devices which are arranged on one or both longitudinal sides and a control connection device which is arranged on a narrow side of the module.