Reduced wire profile stent
US9320623B2 · kind B2 · utility
2Cited by
11References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 3, 2012 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Oct 12, 2032 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA61F2250/0039
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
Methods and apparatuses of stents with likely reduced rates of tissue perforation are provided. Some embodiments include reducing the profile of a portion of the stent using a wire profile reduction electropolishing bath and/or other wire profile reduction means.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.