Lapping device with lapping control feature and method
US9321143B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 8, 2013 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Feb 19, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/00
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A head structure for a lapping assembly including a lapping control feature is disclosed. The lapping control feature includes a raised contact surface elevated from a front surface of the head structure of the lapping assembly. A relative position of the workpiece and raised contact surface are aligned to control workpiece thickness and other lapping parameters. In illustrated embodiments, the relative position of the workpiece and raised contact surface are aligned via an adjustment mechanism on the head structure. In illustrated embodiments, the adjustment mechanism is configured to adjust a position of the workpiece relative to the raised contact surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.