Systems and methods for shaping leads of electronic lapping guides to reduce calibration error
US9321146B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2012 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Mar 14, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Systems and methods for shaping leads of electronic lapping guides to reduce calibration error are provided. One such system includes a device configured to generate predictable resistance for leads of an electronic lapping guide, the device including a lapping surface, and an ELG configured to provide information indicative of a degree of lapping performed on the lapping surface, the ELG including a first electrical lead, a second electrical lead spaced apart from the first electrical lead, and a resistive element between the first electrical lead and the second electrical lead, the resistive element including a right segment, a left segment, and a middle segment that abuts each of the right segment and the left segment, where the right segment is spaced apart from the left segment and the middle segment is adjacent to the lapping surface, where the first and second electrical leads are recessed from the middle segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.