Plasticizer free curing composition
US9321877B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2014 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Sep 3, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08G18/7671
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Plasticizer free curing compositions comprising small particle size complexes of methylenedianiline and an alkali salt, e.g. a 3:1 coordination complex of MDA/alkali salt, with average diameter 60 micron or less, often 20 micron or less, e.g., 10 microns or less, dispersed in a volatile, non-polar, organic solvent are prepared. Stable one pack urethane compositions comprising the plasticizer free curing compositions and polyurethane prepolymers are prepared, which exhibit excellent storage stability and overcome many of the drawbacks encountered when using MDA complexes dispersed in plasticizers such as high boiling aromatic and alkyl di-esters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.