Hybrid integrated optical device with passively aligned laser chips having submicrometer alignment accuracy
US9323011B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2015 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Jun 9, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02B6/4245
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A hybrid optical device includes an optical bench chip, a laser chip with a laser waveguide flip-chip bonded onto the optical bench chip, and an optical waveguide chip with an optical device waveguide disposed adjacent the optical bench chip. The optical bench chip has multiple “U” shaped alignment optical waveguides and the optical waveguide chip has multiple alignment optical waveguides, and the pitches of the various sets of alignment waveguides are different. A misalignment between the laser waveguide and the optical bench chip is compensated for by aligning the optical waveguide chip to different positions of the optical bench chip using the multiple alignment optical waveguides on the optical bench chip and the optical waveguide chip, without turning on the laser, so that the laser waveguide of the laser chip is aligned with the optical device waveguide of the optical device chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.