Thermal mitigation in dual SIM dual active devices

US9323296B2 · kind B2 · utility

Assignee

• QUALCOMM Incorporated · US

Inventors

• Francis Ming-Meng Ngai · Louisville, US
• Amy Derbyshire · Boulder, US
• Ronald Alton · Oceanside, US
• Amit Mahajan · Bound Brook, US
• Michael L. McCloud · Boulder, US
• Reza Shahidi · San Diego, US
• Sridhar Bandaru · Westminster, US
• Ashish Gaonekar · Boulder, US

Key dates

• Filing date: Jun 17, 2013
• Grant date: Apr 26, 2016
• Expiry date: Oct 25, 2034

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02D30/70
• WIPO field: Digital communication
• WIPO sector: Electrical engineering

Abstract

A system, a method and an apparatus are described. The apparatus includes a modem that responds to a thermal mitigation request by invoking different levels of thermal mitigation for different concurrently active connections. In some instances, the modem may invoke thermal mitigation with respect to a first active connection and refrain from invoking thermal mitigation with respect to a second active connection maintained by the modem. The apparatus determines the first and second active connections based on subscriptions corresponding to subscriber identification modules, an identification of a power amplifier or group of power amplifiers responsible for a thermal issue in the modem. The selection of mitigation levels for each active connection and decisions to invoke mitigation on one connection while refraining from invoking mitigation on another connection may be based on priorities of the active connections, including quality of service related priorities.