Patent · US Active

Dispersion for the metallization of contactings

US9324474B2 · kind B2 · utility

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0References

11Claims

0Family size

Assignee

Robert Bosch GmbH · DE

Inventors

Heribert Weber · Leverkusen, DE
Yvonne Bergmann · Reutlingen, DE
Klaus Krueger · Hamburg, DE
Andreas Rathjen · Hamburg, DE

Key dates

Filing date	Nov 26, 2014
Grant date	Apr 26, 2016
Priority date	—
Expiry date	Nov 26, 2034

Classification

Technology area (CPC H)Electricity
CPC primaryH05K2203/1105
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

A dispersion is provided having a dispersion medium and a plurality of colloid particles finely distributed in the dispersion medium, the colloid particles being electrically conductive, the dispersion being a functional ink for the wetting of an inner wall of a contacting opening of a substrate using a print process.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.