Multilayer ceramic electronic component to be embedded in board and printed circuit board having multilayer ceramic electronic component embedded therein
US9324500B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 3, 2014 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Nov 15, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10015
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is provided a multilayer ceramic electronic component to be embedded in a board including: a ceramic body including dielectric layers and having first and second main surfaces opposing one another, first and second lateral surfaces opposing one another, and first and second end surfaces opposing one another; first and second internal electrodes stacked to be spaced apart from both end surfaces of the ceramic body at a predetermined distance with the dielectric layers interposed therebetween, respectively; and first and second external electrodes formed in both end portions of the ceramic body, wherein the first and second external electrodes include first and second base electrodes and first and second terminal electrodes formed on the first and second base electrodes, respectively, and a non-conductive paste layer is formed on both lateral surfaces of the ceramic body.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.