Electronic device comprising an improved lead frame
US9324639B2 · kind B2 · utility
0Cited by
3References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2015 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Jun 19, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An electronic device includes a chip and a support element which supports the chip. Leads are provided to be electrically coupled to at least one terminal of the chip. A coupling element is mounted to a free region of the support element that is not occupied by the chip. The coupling element includes a conductive portion electrically connected to at least one lead and to the at least one terminal of the chip to obtain an electrical coupling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.