Chip-on-film (COF) tape and corresponding COF bonding method
US9324689B2 · kind B2 · utility
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10Claims
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Key dates
| Filing date | Nov 27, 2013 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Jul 20, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1052
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a chip-on-film (COF) tape and a corresponding COF bonding method. The COF tape comprises a base tape, a plurality of first COFs and second COFs, the first and second COFs are arranged on the base tape in an alternating manner, and are correspondingly punched onto a moving platform by a punching mechanism, and are respectively bonded onto two side edges of a liquid crystal panel. The present invention can simultaneously process the bonding operations of the two types of COF by using only one COF tape and one set of equipment, thus lowering the cost and increasing the productivity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.