Method for manufacturing an imaging apparatus having a frame member covering a pad
US9325921B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 2, 2015 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Apr 2, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04N23/57
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid-state imaging apparatus includes: a solid-state imaging device mounted on a substrate; a bonding wire that electrically connects a pad formed on the solid-state imaging device to a lead island formed on the substrate; a frame member that has a frame-like shape and surrounds side portions of the solid-state imaging device; and a light-transmissive optical member so accommodated in the frame member that the optical member faces an imaging surface of the solid-state imaging device, wherein the frame member has a leg portion extending from the side where the optical member is present toward the imaging surface, and the frame member is integrally fixed to the solid-state imaging device with an end of the bonding wire that is connected to the pad covered with the leg portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.