Sensor having a sensor housing
US9326408B2 · kind B2 · utility
0Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 7, 2010 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Jan 10, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A sensor has a sensor housing, an electronic component, and a sensor element. The electronic component and the sensor element are connected to one another in a media-tight manner. An adhesive which provides a seal is placed between bonding sites of a bonding wire of the at least one electrical connection.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.