Heat sink assembly and method of utilizing a heat sink assembly
US9326424B2 · kind B2 · utility
1Cited by
1References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 2014 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Sep 10, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat sink assembly and a method of utilizing a heat sink assembly where the heat sink assembly is configured to dissipate air from the bottom of the heat sink assembly to the top of the heat sink assembly utilizing a plurality of vents to cool a desired electrical component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.