Device for cooling an electronic component in a data center
US9326430B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 26, 2011 |
| Grant date | Apr 26, 2016 |
| Priority date | — |
| Expiry date | Feb 9, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/20772
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A device for cooling an electronic component in a data center is provided. The device includes a closed loop, a first area, a second area, and a barrier. The closed loop includes a first portion and a second portion. The liquid flows around the closed loop. The first area is configured for dissipating heat from the electronic component in the data center to liquid in the first portion of the closed loop. The second area is configured for removing heat from the liquid in the second portion of the closed loop by receiving ambient air, which moves across the second portion, from outside the data center and configured for outputting the ambient air with the dissipated heat from the second area and the data center. The barrier is configured for preventing the ambient air from entering the first area.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.