Method for mitigating cure shrinkage in high temperature-processed thermosetting adhesives and SMC
US9328266B2 · kind B2 · utility
3Cited by
10References
11Claims
0Family size
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Key dates
| Filing date | Oct 22, 2012 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Aug 24, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249984
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A thermosetting polymer composite composition (such as thermosetting SMC composition) or a thermosetting adhesive composition containing reduced-volume hollow shape-memory alloy particles in the thermosetting polymer composite composition or adhesive composition experiences little or no volume loss during a curing at a temperature above the transformation temperature for the particles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.