Edgeless pulse plating and metal cleaning methods for solar cells
US9328427B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Sep 28, 2012 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Mar 1, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02E10/547
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A method for plating metal to a solar cell is disclosed. The method includes plating a metal layer only on the surface of solar cell without plating metal along the solar cell edges by conducting a first current in a first direction in an electroplating bath, ejecting metal from the metal layer by conducting a second current in a second direction and plating additional metal to the metal layer by conducting a third current in the first direction. The first, second and third current can be alternated. Subsequent to an electroplating process, an ultrasonic cleaning process is performed on the solar cell to remove any excess plated metal along the surface and edges of the solar cell.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.