Method and device for determining an orientation of a defect present within a mechanical component

US9329155B2 · kind B2 · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Matthias Goldammer · Birkenfeld, DE
• Werner Heinrich · Prenzlau, DE
• Hubert Mooshofer · Birkenfeld, DE

Key dates

• Filing date: Jul 20, 2015
• Grant date: May 3, 2016
• Expiry date: Jul 20, 2035

Classification

• Technology area (CPC G): Physics
• CPC primary: G01N2291/044
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A technique is provided for determining an orientation of a defect present within a mechanical component using at least one ultrasonic head that applies ultrasonic signals to the mechanical component starting from various measurement points. Echo ultrasonic signals reflected by a point to be analyzed present within the component back to the measurement points are received by the same or a different ultrasonic head. A data processing unit analyzes the received echo ultrasonic signals as a function of a sound emission direction between each measurement ping and the point to be analyzed for determining the orientation of the defect. A distance between the measurement point and the point to be analyzed is calculated for every measurement point as a function of a signal propagation time between the point in time of emitting the ultrasonic signal and the point in time of receiving the echo ultrasonic signal reflected by a defect.