Semiconductor device and method of fabricating the same
US9330913B2 · kind B2 · utility
3Cited by
18References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 2010 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Dec 24, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D64/035
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device includes first, second, and third conductive lines, each with a respective line portion formed over a substrate and extending in a first direction and with a respective branch portion extending from an end of the respective line portion in a direction different from the first direction. The branch portion of a middle conductive line is disposed between and shorter than the respective branch portions of the outer conductive lines such that contact pads may be formed integral with such branch portions of the conductive lines.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.