Patent · US Active

Electronic interconnects and devices with topological surface states and methods for fabricating same

US9331020B2 · kind B2 · utility

1Cited by

2References

21Claims

0Family size

Inventors

Ali Yazdani · Princeton, US
N. Phuan Ong · Montgomery, US
Robert J. Cava · Princeton, US

Key dates

Filing date	Mar 3, 2011
Grant date	May 3, 2016
Priority date	—
Expiry date	Sep 18, 2033

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49204
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

An interconnect is disclosed with enhanced immunity of electrical conductivity to defects. The interconnect includes a material with charge carriers having topological surface states. Also disclosed is a method for fabricating such interconnects. Also disclosed is an integrated circuit including such interconnects. Also disclosed is a gated electronic device including a material with charge carriers having topological surface states.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.