LED die dispersal in displays and light panels with preserving neighboring relationship
US9331230B2 · kind B2 · utility
6Cited by
0References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2012 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Jan 10, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/171
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of dispersing semiconductor chips from a wafer of semiconductor chips onto a substrate while preserving the neighboring relationship of each chip to each adjacent chip is disclosed. The method includes dispersing the wafer into sequential columns of semiconductor chips with a first pitch between columns while preserving the neighboring relationship and sequentially dispersing the columns of semiconductor chips into rows of individual chips with a second pitch between rows onto a substrate while preserving the neighboring relationship.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.