Heat dissipating substrate, and element equipped with same
US9332631B2 · kind B2 · utility
1Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 20, 2013 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Jul 23, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10K2102/3026
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A main object of the invention is to provide a heat dissipating substrate which is excellent in heat dissipating performance, and undergoes neither peel therein nor short circuit. The invention attains this objet by providing a heat dissipating substrate comprising a support base material, an insulating layer formed directly on the support base material, and a wiring layer formed directly on the insulating layer, wherein the insulating layer is formed by non-thermoplastic polyimide resin, and has a thickness in the range of 1 μm to 20 μm.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.