Graphene-based thermal management cores and systems and methods for constructing printed wiring boards
US9332632B2 · kind B2 · utility
18Cited by
94References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 20, 2014 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Aug 20, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0323
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Systems and methods in accordance with embodiments of the invention implement graphene-based thermal management cores and printed wiring boards incorporating graphene-based thermal management cores. In one embodiment, a graphene-based thermal management core includes: a layer including at least one sheet of graphene; a first reinforcement layer; and a second reinforcement layer; where the layer including at least one sheet of graphene is disposed between the first reinforcement layer and the second reinforcement layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.