Flexible printed circuit board for packaging semiconductor device and method of producing the same
US9332649B2 · kind B2 · utility
6Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 30, 2013 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Dec 19, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A flexible circuit board, a semiconductor package, and methods of forming the same are provided. The flexible circuit board includes: a base film; an input line pattern, an output line pattern, and a dummy pattern on a first surface of the base film; and a ground pattern on a second surface of the base film and electrically connected with the dummy pattern.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.