Process for producing structure with metal film, mother die for use in the process, and structure produced by the process
US9332651B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 9, 2009 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Jun 12, 2029 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1152
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention provides is a process for producing a structure (22) with a metal film, including the steps of preparing a mother die (10) in which a first metal film (16) is formed on the surface of a base (12) on which a concave and convex pattern (14) is formed, forming a second metal film (18) on the first metal film (16), adhering a support member (20) to the second metal film (18), and separating the second metal film (18) to which the concave and convex pattern has been transferred to the second metal film (18) together with the support member from the first metal film (16). Preferably, the first metal film (16) is a film containing Cr and Al, and the second metal film (18) is a film containing at least one metal selected from the group consisting of Au, Ag, Cu, Al, and Pt.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.