Method of mounting electronic parts
US9332682B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 2011 |
| Grant date | May 3, 2016 |
| Priority date | — |
| Expiry date | Sep 2, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K13/0857
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In an electronic component mounting method, electronic components are picked up from a component supply unit in which first and second tray supply mechanisms are arranged, and mounted on substrates. In the method, a first substrate and a second substrate different in type from the first substrate are transported by first and second substrate transport lanes, respectively, and a first component to be mounted on the first substrate and a second component to be mounted on the second substrate are supplied by the first and second tray supply mechanisms, respectively. If use stop setting indicating that the pickup of the electronic components is no longer conducted is enabled in one tray supply mechanism, the controller prohibits an access of a mounting head to the one tray supply mechanism, and permits an operation access of an operator to a tray housing unit of the one tray supply mechanism.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.