Method for producing structured microcarriers
US9333501B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 22, 2013 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Jul 22, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01L2300/16
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The present invention relates to a method for producing microcarriers, the method comprising the steps of providing a wafer having a bottom layer, a top layer and an insulating layer, structuring the top layer to define at least one three-dimensional structure on the top surface of the top layer, etching away the top layer to delineate lateral walls of bodies of the microcarriers, applying a continuous polymer layer over the top surface of the bodies of the microcarriers, removing the bottom layer and the insulating layer, structuring the bottom surfaces of the bodies of the microcarriers to define at least one three-dimensional structure on the bottom surface of each body, and removing the polymer layer to release the microcarriers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.