Patent · US Active

Setting method for microplate washing devices

US9333505B2 · kind B2 · utility

0Cited by

3References

19Claims

0Family size

Assignee

TECAN TRADING AG · CH

Inventors

Wolfgang Streit · Salzburg, AT
Juha Koota · Berchtesgaden, DE
Wolfgang Fuchs · Echterdingen, DE

Key dates

Filing date	Jan 24, 2012
Grant date	May 10, 2016
Priority date	—
Expiry date	May 10, 2034

Classification

Technology area (CPC B)Performing Operations; Transporting
CPC primaryB01L2300/0829
WIPO fieldChemical engineering
WIPO sectorChemistry

Abstract

Setting method for microplate washing devices has a receptacle for receiving a microplate and a washing head having washing cannulas. The cannulas are in an array corresponding to a well array with lowermost ends define a work plane. This work plane is parallel to a reference plane. In a first phase, the receptacle and/or washing head are moved together until the lowermost ends of the cannulas touch a surface defining the reference plane. A sensor device has a controller linked thereto and from the sensor device is registered using the controller and a relative altitude value is determined therewith, which indicates touching of the surface by the lowermost ends of the cannulas or for determining the position of this surface. Based on this, an active altitude of the lowermost ends of the washing cannulas in relation to an inner surface of the well bottoms of a microplate is determined.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.