Lead-free solder composition for glass
US9333594B2 · kind B2 · utility
0Cited by
3References
7Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Dec 12, 2012 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Apr 21, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/262
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The present invention provides a lead-free solder composition for glass. The lead-free solder composition for glass includes indium, zinc, and tin. The indium (In) ranges from about 30.0 wt % to about 60 wt %. The zinc (Zn) ranges from about 0.01 wt % to about 11.0 wt %. The tin (Sn) is included as a remaining component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.