Electronics chassis and method of fabricating the same
US9333599B2 · kind B2 · utility
6Cited by
13References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 2013 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Jul 16, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49826
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronics chassis is provided. The electronics chassis includes a plurality of panels that define an interior space. One panel of the plurality of panels has a composite segment having an internal face and an external face. The electronics chassis further includes a conductive thermal pathway that extends through the panel from the internal face of the composite segment to the external face of the composite segment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.