Method and device for cutting out hard-brittle substrate and protecting regions on the substrate
US9333624B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 1, 2013 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Jan 16, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24C3/32
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
To cut out a hard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2; and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.