Imprinting apparatus and imprinting method using the same
US9333700B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2014 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Apr 5, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Disclosed is an imprinting apparatus and imprinting method using the same that prevent a process of forming a pattern on a substrate from being affected by flatness of a stage. The imprinting apparatus comprises a chamber unit in which a process of forming a pattern on a substrate is carried out; a stage for supporting the substrate on which a resin layer is formed; an installing member positioned above the stage and having a mold member attached to transform the resin layer so as to form the pattern on the substrate; and a first spraying unit for spraying fluid to separate the substrate supported by the stage from the stage, wherein the installing member moves the mold member in the direction getting near to the substrate separated from the stage so that the mold member and the resin layer are brought into contact with each other.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.