MEMS device connected to a substrate by flexible support structures
US9334153B1 · kind B1 · utility
5Cited by
3References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 3, 2014 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Nov 3, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2207/07
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
A MEMS assembly comprising a substrate and a MEMS device; wherein the MEMS device is connected to the substrate by at least two flexible support structures made in a conductive layer formed on a first portion of one of the substrate and the MEMS.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.