Integrated chip with micro-electro-mechanical system and integrated circuit mounted therein and method for manufacturing the same
US9334159B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 11, 2013 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Jun 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/11
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
The invention relates to an integrated chip with an MEMS and an integrated circuit mounted therein and a method for manufacturing the same. The method includes the steps of: S1: providing a first chip, wherein the first chip comprises a first substrate, an MEMS component layer formed on the first substrate and comprising a first electrical bonding point disposed on MEMS the component layer; S2: providing a second chip with an IC integrated circuit, wherein the second chip comprises a second lead layer and a second electrical bonding point; S3: bonding the first electrical bonding point and the second electrical bonding point; S4: processing a thinning operation for the bottom surface of the first substrate; and S5: forming an electrical connection layer electrically connected to an external circuit on the bottom surface of the first substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.