Film made of polyaryleetherketone
US9334356B2 · kind B2 · utility
0Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 19, 2010 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Oct 24, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/269
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The invention relates to a molding compound, comprising the following components: a) 60 to 96% by weight polyaryletherketone, b) 2 to 25% by weight hexagonal bornite, and c) 2 to 25% by weight talcum, wherein the sum of the parts by weight of components a), b), and c) is 100. Said compounds can be used to produce a film having a thickness of 5 to 1200 μm, which is suitable for producing dimensionally stable circuit boards.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.