Patent · US Active

Polyamide resin moldings

US9334365B2 · kind B2 · utility

1Cited by

3References

10Claims

0Family size

Assignee

Mitsubishi Gas Chemical Company, Inc. · JP

Inventors

Jun Mitadera · Yokohama, JP
Masashi Kurokawa · Ritto, JP
Takahiro Takano · Yokohama, JP

Key dates

Filing date	Sep 29, 2011
Grant date	May 10, 2016
Priority date	—
Expiry date	Mar 14, 2032

Classification

Technology area (CPC C)Chemistry; Metallurgy
CPC primaryC08J2377/06
WIPO fieldMacromolecular chemistry, polymers
WIPO sectorChemistry

Abstract

Provided is a xylylenesebacamide resin molding which is excellent in mechanical strength such as elastic modulus and avoids the problem of mechanical strength loss during long-term use. This is a molding of a polyamide resin or a polyamide resin composition containing the polyamide resin, wherein 70 mol % or more of the diamine structural unit is derived from xylylenediamine (A) and 50 mol % or more of the dicarboxylic acid structural unit is derived from sebacic acid (B), and the molding has a crystallinity index of 0 to 50% and a moisture content of 0.1 to 2% by mass.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.