Photosensitive resin composition and black spacer using the same
US9334399B2 · kind B2 · utility
0Cited by
46References
9Claims
0Family size
Assignee
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Key dates
| Filing date | Oct 28, 2013 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Oct 28, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2312/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed are a photosensitive resin composition including (A) a thermally curing initiator having a half-life of about one hour at a temperature ranging from about 100 to about 150° C.; (B) a photopolymerization initiator; (C) a binder resin; (D) a photopolymerizable compound; (E) a colorant; and (F) a solvent, and a black spacer using the same.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.