Patent · US Active

Deformation sensor package and method

US9335225B2 · kind B2 · utility

4Cited by

3References

18Claims

0Family size

Assignee

MEASUREMENT SPECIALTIES, INC. · US

Inventors

Han Xu · Aliso Viejo, US
Anthony S. Chu · Laguna Niguel, US
Barry Singer · Melbourne, AU

Key dates

Filing date	Nov 4, 2013
Grant date	May 10, 2016
Priority date	—
Expiry date	Jun 28, 2034

Classification

Technology area (CPC G)Physics
CPC primaryG09B23/32
WIPO fieldMeasurement
WIPO sectorInstruments

Abstract

A deformation sensor package includes a housing having a base and a peripheral wall extending from the base. The base and peripheral wall define two cavities each configured to receive a potentiometer, such as a string potentiometer. The peripheral wall defines two apertures formed between a respective cavity and an exterior of the housing. Each aperture is configured to allow for the passage of a moveable sensing end of an associated potentiometer therethrough.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.