Ceramic board, method manufacturing thereof, image sensor package and method of manufacturing the same
US9337114B2 · kind B2 · utility
3Cited by
6References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 23, 2011 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Oct 15, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49124
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Disclosed herein is a ceramic board and the manufacturing method and an image sensor package and a manufacturing method thereof, the ceramic board including a ceramic body in which an upper surface is formed with a first groove, a second groove is formed in the first groove, and the second groove is formed with a through hole; a first electrode pad formed in the first groove; and a second electrode pad formed at any one of the upper surface, a lower surface and the both surfaces of the ceramic body, electrically connected to the first electrode pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.