Multi-substrate image sensor having a dual detection function
US9337227B2 · kind B2 · utility
3Cited by
1References
10Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 8, 2012 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Aug 8, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10F39/811
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The present invention relates to an image sensor in which substrates are stacked, wherein a substrate-stacked image sensor according to the present invention is configured such that a first photodiode is formed on a first substrate, a second photodiode is formed on a second substrate, the two substrates are aligned with and bonded to each other to electrically couple the two photodiodes to each other, thereby forming a complete photodiode within one pixel.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.