Antenna-printed circuit board package
US9337526B2 · kind B2 · utility
21Cited by
7References
26Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 27, 2012 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Jul 23, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
An antenna-printed circuit board (PCB) package is provided. The antenna-PCB package includes a PCB; an antenna portion formed on an upper surface of the PCB and inside the PCB; and a radio frequency integrated circuit (RFIC) chip bonded to a lower surface of the PCB.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.