Laser component and method for its production
US9337612B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 14, 2015 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Jul 14, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49147
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser component includes a housing and a laser chip arranged in the housing, wherein the housing includes a first soldering contact and a second soldering contact at a first outer surface, and a third soldering contact and a fourth soldering contact at a second outer surface, the first soldering contact connects to the third soldering contact in an electrically conductive manner and the second soldering contact connects to the fourth soldering contact in an electrically conductive manner, the housing includes a carrier substrate and a cover, a bottom side of the laser chip is arranged on the carrier substrate, the cover includes an encapsulation material, the laser chip is covered by the encapsulation material, and a beam direction of the laser chip is oriented in parallel to the bottom side of the laser chip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.