Method of attaching electronic module on fabrics by stitching plated through holes
US9338915B1 · kind B1 · utility
7Cited by
11References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 27, 2014 |
| Grant date | May 10, 2016 |
| Priority date | — |
| Expiry date | Mar 27, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more plated through holes, through each of which is coupled an electrically conductive wire. The electrically conductive wire is stitched through the plated through hole and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.