Over-molded rotationally coupled assemblies
US9339625B2 · kind B2 · utility
0Cited by
9References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 11, 2012 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Apr 11, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2031/24
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
An assembly including a first component and a second component movably coupled to the first component. The second component is formed about and coupled to at least a portion of the first component via an over-molding process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.