Method and device for printing on heated substrates
US9340016B2 · kind B2 · utility
1Cited by
12References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 17, 2010 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Mar 4, 2032 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41J2202/08
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
A printing device for dispending material on a heated substrate is provided. The device may include a printing head having one or more nozzles and a heat shield that partially masks a side of the printing head that faces the heated substrate when printing so as to reduce heat transfer from the substrate to the printing head. The shield includes a slot aligned with the one or more nozzles to enable passage of material from the one or more nozzles to the heated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.