Conductive metal ink composition, and method for forming a conductive pattern
US9340684B2 · kind B2 · utility
0Cited by
2References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 6, 2011 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Jan 10, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/095
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
An exemplary embodiment of the present invention relates to a conductive metal ink composition comprising a conductive metal powder; a non-aqueous solvent; an organo phosphate compound; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.