Methods of forming dry adhesive structures
US9340708B2 · kind B2 · utility
8Cited by
5References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2015 |
| Grant date | May 17, 2016 |
| Priority date | — |
| Expiry date | Aug 31, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24479
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods of forming dry adhesives including a method of making a dry adhesive including applying a liquid polymer to the second end of the stem, molding the liquid polymer on the stem in a mold, wherein the mold includes a recess having a cross-sectional area that is less than a cross-sectional area of the second end of the stem, curing the liquid polymer in the mold to form a tip at the second end of the stem, wherein the tip includes a second layer stem; corresponding to the recess in the mold, and removing the tip from the mold after the liquid polymer cures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.