Vent structures for encapsulated components on an SOI-based photonics platform

US9341792B2 · kind B2 · utility

Assignee

• Cisco Technology, Inc. · US

Inventors

• Mary Nadeau · Alburtis, US
• John Fangman · Leesport, US
• Duane Stackhouse · Coopersburg, US
• Craig A. Young · Nazareth, US
• David Piede · Allentown, US
• Vipulkumar Patel · Emmaus, US

Key dates

• Filing date: Jun 7, 2011
• Grant date: May 17, 2016
• Expiry date: Jul 1, 2031

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01S5/0683
• WIPO field: Optics
• WIPO sector: Instruments

Abstract

An silicon-on-insulator (SOI)-based photonics platform is formed to including a venting structure for encapsulating the active and passive optical components formed on the SOI-based photonics platform. The venting structure is used to allow for the encapsulated components to “breathe” such that water vapor and gasses will pass through the package and not condensate on any of the encapsulated optical surfaces. The venting structure is configured to also to prevent dust, liquids and other particulate material from entering the package.